Sign In | Join Free | My lightneasy.org
China Shenzhen Hiner Technology Co.,LTD logo
Shenzhen Hiner Technology Co.,LTD
Verified Supplier

5 Years

Home > Bare Die Trays >

Impact-Resistant Anti-Static Tray for Compact Storage of Semiconductor Bare Dies

Shenzhen Hiner Technology Co.,LTD
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

Impact-Resistant Anti-Static Tray for Compact Storage of Semiconductor Bare Dies

Brand Name : Hiner-pack

Model Number : HN24039

Place Of Origin : Shenzhen, China

Certification : ISO 9001 ROHS SGS

MOQ : 1000 Pcs

Price : $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities)

Packaging Details : It Depends On The QTY Of Order And Size Of Product

Delivery Time : 5~8 Working Days

Payment Terms : T/T

Supply Ability : 4000PCS~5000PCS/per Day

Size : 2-inch And 4-inch

Optional : Lid/Cover And Clip/Clamp

Stackable : Yes

Durability : Sturdy And Impact-Resistant

Application : Transport, Storage, Packing Of Bare Die

Property : ESD Or Non-ESD

Customizable Logo : Available

Contact Now

Anti-Static Tray For Compact Storage Of Semiconductor Bare Dies

This meticulously crafted waffle pack chip tray features a high level of precision and is structured according to the widely-accepted 2x2 inch standard dimensions. It is specifically designed to securely house and move delicate semiconductor dies and chip-scale packages (CSPs) without risking damage. Each individual tray is crafted with a consistent grid of pockets customized to cradle 2.5D elements with minimal surface irregularities.

Constructed from electrically conductive plastic, this tray offers crucial protection against electrostatic discharge while also retaining the needed stiffness and dimensional steadiness. Its adaptability for integration into automated manufacturing processes makes it a vital element within the realms of microelectronic packaging, testing, and examination procedures.

Features:

1. Compact 2x2 inch footprint suitable for small die and CSP formats;

2. Precision-molded conductive polymer ensures ESD protection and part stability;

3. Customizable pocket shapes and depths to accommodate irregular geometries;

4. Compatible with standard clip systems, stackable design with top tray cover options;

5. Durable construction resists warping and maintains alignment under handling stress;

6. Heat-resistant versions are available for thermal testing or baking environments.

Technical Parameters:

HN24039 Technical Data Ref.
Base Information Material Color Matrix QTY Pocket Size
ABS Black 4*3=12PCS 10.70*8.20*0.58mm
Size Length * Width * Height (according to customer's requirement)
Feature Durable; Reusable; Rcofriendly; Biodegradable
Sample A. The free samples: Choosen from existing products.
B. Customized samples as per your design/demand
Accessory Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format PDF,2D,3D

Applications:

Optimized for the use of bare die, chip-scale packages, and small photonic or optical elements, this waffle tray is specifically designed for back-end processes. These processes commonly include inspection, die sorting, packaging, and prototype assembly. The tray is engineered to facilitate tray loading operations, where precise alignment and repeatability play crucial roles. As a result, it is highly suitable for environments such as R&D labs, engineering lines, and pilot production setups that are moving towards automation.


Product Tags:

Anti-Static Tray for Bare Die

      

Compact Bare Die Trays

      

Semiconductor Bare Die Trays

      
Buy cheap Impact-Resistant Anti-Static Tray for Compact Storage of Semiconductor Bare Dies product

Impact-Resistant Anti-Static Tray for Compact Storage of Semiconductor Bare Dies Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Shenzhen Hiner Technology Co.,LTD
*Subject:
*Message:
Characters Remaining: (0/3000)