Chip Scale Packages IC Die Carriers For Precise Die Placement And Stackable
Bare Die Trays, also known as waffle pack trays, are typically described as thin trays with a square shape, measuring either 2 inches or 4 inches. These trays feature a series of separator ribs arranged in a regular pattern, creating pockets that give the trays a resemblance to a waffle.
Waffle pack chip trays are mainly employed for the handling and transportation of bare die or chip scale packages (CSP). They are equipped with straightforward rectangular pockets. On the other hand, custom waffle pack trays are widely used in applications where existing processes utilize the waffle pack format but require specific properties, such as the use of bakeable materials or unique pocket geometry.
Features:
These die trays are carefully designed to ensure that the materials used absorb all of the electrostatic discharge (ESD) generated during the handling and transportation of dies.
Moreover, these trays are temperature range friendly, making it easy to handle the dies as they move from one process to another. This feature guarantees the perfect temperature range in which the dies should be placed.
The die trays are certified for use in a 100% contaminant-free clean room environment, as they effectively absorb the electric shocks that could damage the dies.
They come in various die sizes and are compatible with all types of dies, giving users the flexibility to choose according to their needs.
Technical Parameters:
| HN24008 Technical Data Ref. |
| Base Information | Material | Color | Matrix QTY | Pocket Size |
| ABS | Black | 30*23=690PCS | 1.1*0.7*0.7mm |
| Size | Length * Width * Height (according to customer's requirement) |
| Feature | Durable; Reusable; Rcofriendly; Biodegradable |
| Sample | A. The free samples: Choosen from existing products. |
| B. Customized samples as per your design/demand |
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper |
| Artowrk Format | PDF,2D,3D |
Applications:
The die tray plays a crucial role in the manufacturing and assembly process of semiconductor dies. A die serves as a key link used by semiconductor companies to transfer dies between different production facilities. It not only facilitates the movement of dies but also ensures their safety during testing and storage.
Aside from transportation, die trays are utilized to secure the dies during testing and for long-term storage purposes. These trays are commonly found in semiconductor research institutions, stores, and production units, making them easily accessible to manufacturers.
Primarily designed for transporting and testing prototype semiconductor dies, the die tray serves as an essential tool in the production and testing stages of semiconductor devices.
